This project is the theoretical study of the propagation of cracks generated in silicon wafers during processing. A visual analysis of the geometry and shape of the cracks will be made using electronic microscopy images. The stability of the cracks during the processing steps (cooling down, deposition of various layers, etc.) will be simulated using analytical models based on linear elastic fracture mechanics.
Microscopy images and details of the processing are provided by INTEL and the theoretical analysis is performed by IMDEA Materials Institute.
Partners: INTEL Ireland
Funding Organisation: INTEL Ireland
Industrial Sector: Electronics
Project Period: 2008
Principal Investigator: Dr. Javier Segurado