Menu
Novel silicone-phenyl contained amine curing agent for epoxy resin: 1. Non-isothermal cure and thermal decomposition
Cao, Jun; Hu, Jijiang; Fan, Hong; Wan, Jintao; Li, Bogeng
Silicone-modified phenolic resin: Relationships between molecular structure and curing behavior
Li, Cheng; Ma, Zhongzhu; Zhang, Xianwei; Fan, Hong; Wan, Jintao
